Semi-Automatic SolderPaste Printer
Category: SMT Machines
Description:
FEATURES :
- PLC Control System to ensure working stabilized & reliable; Touch screen is easy to operate.
- High Rigidity structure and linear rails ensure the stabilities and precision of printing.
- This printer can automatically set the running parameters to comport with all kind of products and get best performance according to different characteristic of glue and solder paste.
- Flexible arming base with the arms can be adjusted toward right or left to match different size of PCB.
- The printing knife can be rotated 45? upward then fixed to convenient for the clean & replace of knife and stencils. Calibration method is to use the movement of stencil to match with X,Y,Z of printing base
SPECIFICATIONS :
|
Model Features |
ET-680-SP |
ET-740-SP |
|
Description |
Suitable for printing solder paste and glue for all kinds of thick or thin PCB (Single or Double) |
|
|
Power Requirement |
220V AC, 50 Hz, 1 Phase |
|
|
Power Consumption |
100 W |
|
|
PCB Thickness Range |
0.2 – 3.0 mm |
|
|
Fine Adjustment of Platform |
+ 0.05 mm |
|
|
Respectable Precision |
+ 0.02 mm |
|
|
Air Supply |
4 – 6 Kg/cm sq |
|
|
Printing Platform |
320 x 500 mm |
320 x 500 mm |
|
Stencil Dimension |
370x470 to 550x650mm |
370x470 to 736x736mm |
|
PCB Dimension |
320 x 450 mm |
320 x 500 mm |
|
PCB Positioning Method |
Positioning Pin |
Positioning Pin |
|
Printing Method |
Stencil Movement |
Stencil Movement |
|
Dimension |
L-880, W-680, H-1650mm |
L-1000, W-870, H-1650mm |
|
Weight |
220 Kg |
260 Kg |
